In Terms of Surface Quality
When the cutting parameters are not set properly, WEDM will produce a recast layer on the sample surface. The recast layer is a layer of tissue formed by the remelting and solidification of the melted metal on the sample surface during the electrical discharge machining process. This is because the high - temperature melting process of WEDM will cause part of the material to vaporize and melt, and after the processing is completed, these melted metals may reattach to the sample surface.
The existence of the recast layer will have an adverse impact on EBSD analysis. EBSD analysis is based on the principle of Electron Back - Scatter Diffraction to determine information such as grain size and crystal orientation. The recast layer changes the original micro - structure of the sample surface and interferes with the acquisition of Electron Back - Scatter Diffraction signals. For example, it may lead to misjudgment of the grain size because the existence of the recast layer may make the actual grain boundaries blurred, or it may affect the accurate judgment of the crystal orientation, causing deviations in the obtained Orientation Imaging Map (OIM).

 

In Terms of Processing Cost
The equipment for WEDM is relatively complex and needs to be equipped with components such as a high - frequency pulsed power supply and a working fluid circulation system. The procurement cost of these equipment is relatively high, and the maintenance and operation of the equipment also require certain expenses. For example, the high - frequency pulsed power supply may malfunction and require professional maintenance, and the working fluid needs to be replaced regularly, all of which will increase the use cost.
The electrode wires and working fluids consumed during the processing of WEDM are also part of the cost. The electrode wires will wear out after long - time cutting and need to be replaced, and the working fluid will also be consumed with use. For large - scale EBSD sample preparation, the accumulated cost of these consumables will be relatively high.

 

 

 

 

 

 

 

 

BV/EH32 high Strength Chemical Composition in Tempering and Quenching
Grade	The Element Max (%)
	C	Si	Mn	P	S	Al	N
BV/EH32	0.18	0.1-0.50	0.90-1.6	0.035	0.035	0.015
	Nb	V	Ti	Cu	Cr	Ni	Mo
	0.02-0.05	0.05-0.10	0.02	0.35	0.2	0.4	0.08

 

 

In Terms of Processing Precision Control
Although WEDM can achieve relatively high cutting precision and obtain a relatively small cutting gap (generally around 0.1 - 0.3 mm), it requires high operational requirements to maintain this precision. The cutting process is affected by various factors, such as discharge parameters (including discharge energy, discharge frequency, etc.), the tension of the electrode wires, and the wire - feeding speed.
For example, if the discharge energy is too large, it may cause the cutting gap to exceed the expected range or produce more heat - affected zones on the sample surface, affecting the results of EBSD analysis; while the instability of the tension of the electrode wires may cause deviations in the cutting path. For some EBSD samples with high requirements for shape precision, such as those that need to be precisely cut into specific angles or curves, the processing requirements may not be met.

 

 

 

 

We take pride in our ability to provide custom solutions for our customers' unique needs.
We analyze and compare the previous products and the current technical situation of our BV EH32 Steel Plate, and develop new technical specifications and processes.
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